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vfhd1116p - 4c32b - tr page : 1 2013.6.28 1608 size with dome lens, emitting color : yellow green outer dimension 1.64 x 0.84 x 1.26mm ( l x w x h ) ? narrower distribution angle, high brightness ? moisture sensitive level : 3 (ipc/jedec j - std - 020d) ? lead C free soldering compatible ? rohs compliant ? indicator lighting for automotive use, various indicators, etc. standard product reference sheet features recommended applications package product features
vfhd1116p - 4c32b - tr cathode mark cathode anode polarity mark unit :mm weight :1.7mg tolerance : 0.1 outline dimensions recommended pad unit :mm page : 2 2013.6.28 no. part name material qty. led die algainp 1 lens epoxy resin 1 substrate glass fabrics 1 electrode au/ni/cu 2
vfhd1116p - 4c32b - tr specifications rth(j - a)measurement condition ? pcb fr4 t=1.6mm) ? pattern size 16mm 2 page : 3 2013.6.28 -40 +100 i f 30 ma i frm 3.33 ma/ 81 repetitive peak forward current "1ms,1/20duty" (ta=25 ) milky white algainp yellow green ma product overview lens color (emitting area) power dissipation p d die material emitting color units mw absolute maximum ratings item symbol maximum ratings notes 2 symbol tj item junction temperature i frm 100 t opr reverse voltage v r 5 forward current (ta=25 ) notes 3 units /w /w 600 400 - - - 105 v i f 1.00 i f derate linearly from "75 " notes 3 thermal resistance junction - ambient r th(j-a) thermal resistance junction - solder point r th(j-s) storage temperature t stg t sld operating temperature soldering temperature "reflow soldering" -40 +105 electrostatic discharge threshold "hbm" esd 1,000 260 i frm derate linearly from "75 " ma/ notes 1 thermal characteristics esd testing method : eiaj4701/300(304) human body model(hbm) 1.5k ? , 100pf notes 1 notes 2 please refer to page 8, "soldering conditions". typ. max. v
vfhd1116p - 4c32b - tr specifications page : 4 2018.3.28 forward voltage reverse current units nm ? nm 1.7 - peak wavelength dominant wavelength 150 i f = 20ma 570 1.9 mcd nm - - 575 573 note: p i f = 20ma i f = 20ma v r = 5v electro and optical characteristics item i r i f = 20ma i v luminous intensity v v f 2.5 (ta=25 ) i f = 20ma 220 576 - min. typ. max. symbol conditions 15 d a 330 - spectral line half width half intensity angle 21/2 10 - i f = 20ma - 190 - mlm luminous flux v above luminous intensity (i v ) values and dominant wavelength (d) values are the setup value of the selection machine tolerance : iv10%,d1nm i f = 20ma - 35 - nm d (nm) min. max. i f =20ma ta=25 c4 180 220 above luminous intensity (iv) values and dominant wvelength (d) values are the setup value of the selection machine. tolerance : iv10%, d1nm c5 220 i v (mcd) sorting chart for luminous intensity and dominant wavelength leds shall be sorted out into the following ranks of luminous intensity and dominant wavelength. 150 min. c3 max. luminous intensity (iv) rank rank rank dominant wavelength (d) rank 570 c6 270 330 conditions conditions 180 c 573 576 b 573 270 i f =20ma ta=25
vfhd1116p - 4c32b - tr 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 380 430 480 530 580 630 680 730 780 page : 5 x, and y direction: same shape 100 50 0 50 100 90 - 90 - 60 - 30 6 0 30 0 100 50 spectral distribution condition: ta = 25 , i f = 20ma wavelength: (nm ) relative intensity spatial distribution condition: ta = 25 , i f = 20ma relative intensity : (%) technical data page : 5 2014.6.17 x y
vfhd1116p - 4c32b - tr 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 -40 -20 0 20 40 60 80 100 ambient temperature vs. forward voltage condition: i f = 20ma ambient temperature: ta ( ) 0.1 1.0 10.0 -40 -20 0 20 40 60 80 100 120 0.0 0.5 1.0 1.5 2.0 0 5 10 15 20 25 30 ci 1 10 100 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 forward current vs. relative intensity condition: ta = 25 forward current: i f (ma) forward voltage vs. forward current condition : ta = 25 forward voltage: v f (v ) ambient temperature vs. relative intensity condition: i f = 20ma ambient temperature: ta ( ) forward current: i f (ma) relative intensity relative intensity technical data forward voltage: v f (v) page : 6 2013.6.28
vfhd1116p - 4c32b - tr 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 duty=5% duty=10% duty=20% duty=50% dc 566 568 570 572 574 576 578 580 -40 -20 0 20 40 60 80 1 10 100 1 10 100 570 571 572 573 574 575 0 5 10 15 20 25 30 ci ambient temperature vs. max . forward current pulse width tw Q 1ms , repetition frequency : f R 50hz ambient temperature: ta ( ) forward current vs. dominant wavelength condition: ta = 25 forward current: i f (ma ) ambient temperature vs. dominant wavelength condition: i f = 20ma ambient temperature: ta ( ) duty cycle vs. max . forward current condition : ta = 25 duty cycle: d (%) dominant wavelength : d (nm) maximum forward current : i frm max. (ma) dominant wavelength : d (nm) maximum forward current : i frm max. (ma) technical data page : 7 2013.6.28
vfhd1116p - 4c32b - tr page : 8 soldering condition 1. heat stress during soldering will influence the reliability of leds, however that effect will vary on heating method. also, if components of varying shape are soldered together, it is recommended to set the soldering pad temperature according to the component most vulnerable to heat (e.g., surface mount led). 2. led parts including the resin are not stable immediately after soldering ( when they are not at room temperature), any mechanical stress may cause damage to the product. please avoid such stress after soldering, especially stacking of the boards which may cause the boards to warp and any other types of friction with hard materials . 3. recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. temperature distribution varies on heating method, pcb material, other components in the assembly, and mounting density. please do not repeat the heating process in reflow process more than twice. notes 1 temperature profile for the reflow should be set to the surface temperature of resin which is on the top of led. this should be the maximum temperature for soldering. lowering the heating temperature and decreasing heating time is very effective in achieving higher reliability . notes 2 the reflow soldering process should be done up to twice(2 times max). when second process is performed , interval between first and second process should be as short as possible to prevent absorption of moisture to resin of led. the second soldering process should not be done until leds have returned to room temperature (by nature - cooling) after first soldering process. soldering precaution (acc.to:eiaj - 4701/300) page : 8 2014.6.17 recommended reflow soldering condition 40sec max. 150 180 +1.5 +5 /s 260 max. - 1.5 - 5 /s 90~ 120sec max. pre - heating (soldering 230 max. peak temperature
vfhd1116p - 4c32b - tr page : 9 soldering condition 4. if soldering manually, stanley recommends using a soldering iron equipped with temperature control. during the actual soldering process , make sure that the soldering iron never touches the led itself, and avoid the led's electrode heating temperature reaching above the heating temperature of the solder pad. all repairs must be performed only once in the same spot, and please avoid reusing components. 5. in soldering process, immediately after iron tip is cleaned, please make sure that the soldering iron reaches the appropriate temperature before using. also, please avoid applying any types of pressure to the soldered components before the solder has been cooled and hardened, as it may deteriorate solder performance and solder quality. recommended manual soldering condition temperature of iron tip 350 max. soldering duration, time 3sec.max.,1 time page : 9 2014.6.17 6. when using adhesive material for tentative fixatives, thermosetting resin or ultraviolet radiation (uv) setting resin with heat shall be recommended. the curing condition, temperature:150 max./ time:120sec.max . 7. isopropyl alcohol is recommended for cleaning. some chemicals, including freon substitute detergent could corrode or affect the optical characteristics of the lens or the casing surface. please review the reference chart below for cleaning. cleaning with ultrasonic shall not be recommended . 8. flow soldering (dip soldering) is not recommended for this product. cleaning agents recommended / not recommended isopropyl alcohol ? recommended ethyl alcohol ? recommended pure water ? recommended trichloroethylene x not recommended chlorothene x not recommended acetone x not recommended thinner x not recommended
vfhd1116p - 4c32b - tr handling precaution other precautions 1. the products are designed to achieve the highest performance reliability, however they can be influenced by usage conditions. 2. absolute maximum ratings are set to prevent led lamps from failing due to excess stress( temperature, current, voltage, etc.). usage conditions must not exceed the ratings for a moment, nor do reach one item of absolute maximum rating s simultaneously . 3. to achieve the highest performance reliability, it is necessary to take into account, factors such as forward voltage adjusted to the usage temperature condition, derating of the power consumption, and other variable factors. 4. please insert straight protective resistors into the circuit in order to stabilize led operation and to prevent the device from igniting due to excess current. 5. please check the actual performance in the assembly because the specification sheets are described for led device only. 6. please refrain from looking directly at the light source of led at high output, as it may harm your vision. 7. the products are designed to operate without failure in recommended usage conditions. however , please take the necessary precautions to prevent fire, injury, and other damages should any malfunction or failure arise. 8. the products are manufactured to be used for ordinary electronic equipment. please contact our sales staff beforehand when exceptional quality and reliability are required, and the failure or malfunction of the products might directly jeopardize life or health ( such as for airplanes, aerospace, transport equipment, medical applications, nuclear reactor control systems and so on). 9. the formal specification sheets shall be valid only by exchange of documents signed by both parties. page : 10 2014.6.17
vfhd1116p - 4c32b - tr this product is baked (moisture removal) before packaging, and is shipped in moisture - proof packaging (as shown below) to minimize moisture absorption during transportation and storage. however, with regard to storing the products, stanley recommends the use of dry - box under the following conditions is recommended. moisture - proof bag as the packaging is made of anti - static material but packaging box is not. the package should not be opened until immediately prior to its use, and please keep the time frame between package opening and soldering which is maximum 168h . if the device needs to be soldered twice, both soldering must be completed within the 168h . if any components should remain after their use, please seal the package and store them under the conditions described in the recommended storage condition . this product must be required to perform baking process (moisture removal) for at least 48h,not exceed for 72h, at 60+ 5 degrees celsius if following conditions apply. 1. in the case of silica gel (blue) which indicates the moisture level within the package, changes or loses its blue color. 2. in the case of time is passed for 168h after the package is opened once. baking process should be performed after led having been taken out of the package. baking may be performed in the tape - reel form , however if it is performed with the reel stacked over one another, it may cause deformation of the reels and taping materials and later obstruct mounting. please handle only once it has returned to room temperature. provided that, baking process shall be 2 times max. time elapsed after package opening. in the case of the package unopened , 6 months under recommended storage condition . please avoid rapid transition from low temp. condition to high temp. condition and storage in corroding and dusty environment. recommended storage condition / products warranty period temperature +5 30 humidity under 70% page : 11 2014.6.17 packaging specifications
vfhd1116p - 4c32b - tr packaging specification moisture - proof packaging specification fastener for re - storage after opening bag customer's opening position product label (desiccant with indicator for moisture level is enclosed .) a flow chart - package opening to mounting heat sealing position (after product being put in) allowable leaving time means the maximum allowable leaving time after opening package, which depends on each led type. the allowable leaving time should be calculated form the first opening of package to the time when soldering process is finished. when judging if the allowable leaving time has exceeded or not, please subtract the soldering time. the allowable leaving time after reopening should be calculated form the first opening of package, or from the time when baking process is finished. page : 12 2014.6.17 yes no yes no yes no baking led under recommended condition product mounting unused-product remained return to moisture-proof package and seal finished reopen the moisture-proof package flow chartpackage opening to mounting stored under recommended condition moisture-proof package first time opening allowable leaving time exceeded (*) discoloration of silica gel no. part name matelrial remarks moisture-proof bag with aluminum layer pet+al+pe with esd protection
vfhd1116p - 4c32b - tr packing box (rohs ? elv compliant) the above measure is all the reference value. box for shipment is selected out of the above table, according to the shipping quantity. b type a material / box cardboard c5bf type b,c material / box cardoard k5af partition cardoard k5bf box type outline dimension l w h (mm) capacity of the box type a 280 265 45 3 reels type b 310 235 265 15 reels type c 440 310 265 30 reels page : 13 2014.6.17 packaging specifications no. part name matelrial remarks packing box corrugated cardboard without esd protection
vfhd1116p - 4c32b - tr label specification ( acc.to jis - x0503(code - 39) ) product label a. parts number b. bar - code for parts number c . parts code (in - house identification code for each parts number) d. packed parts quantity e. bar - code for packed parts quantity f. lot number & rank ( refer to lot number notational system for details ) g . bar - code for lot number & rank opto device label a. customer name b. parts type c. parts code d. parts number e. packed parts quantity f. carton number g. shipping date h. bar - code for in - house identification number < remarks> bar - code font : acc.to code - 39(jis - x0503 ) packaging specifications b a page : 14 2014.6.17
vfhd1116p - 4c32b - tr ( acc.to jis - c0806 - 03 ) appearance items specifications remarks leader area cover - tape cover - tape shall be longer than 320mm without carrier - tape the end of cover - tape shall be held with adhesive tape. carrier - tape empty pocket shall be more than 25 pieces. please refer to the above figure for taping & reel orientation . trailer area empty pocket shall be more than 40 pieces. the end of taping shall be inserted into a slit of the hub. page : 15 note " - tr" means cathode s ide of leds should be placed on the sprocket - hole side. 2014.6.17 taping and reel specifications
vfhd1116p - 4c32b - tr taping and reel specifications (acc.to jis - c0806 - 03 ) 3,000parts/reel minimum qty. per reel might be 500 parts when getting less than 3 ,000 parts. in such case, parts of 500 - unit - qty. shall be packed in a reel and the qty . shall be identified on the label cover - tape adhesive strength shall be 0.1 1.0n ( an angle between carrier - tape and cover - tape shall be170 deg. ) both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at a radius of 15mm. reversed - orientation, up - side down placing, side placing and out of spec. parts mix shall not be held. max qty. of empty pocket per reel shall be defined as follows. qty . per reel mechanical strength others page : 16 2014.6.17 1,500 1,000 1 - 2,000 - 2 no continuance 3,000 3 no continuance 2,500 2 remarks max. qty. of empty pocket qty./reel no continuance 1 - 500 1
vfhd1116p - 4c32b - tr taping dimensions reel dimensions taping and reel specifications ( acc.to jis - c0806 - 03 ) unit :mm page : 17 2014.6.17 no. part name remarks carrier-tape cover-tape conductive grade anti-static grade conductive grade carrier-reel
vfhd1116p - 4c32b - tr lot number notational system page : 18 2014.6.17 - 1digit production location (mark identify alphabet) - 1digit production year (the last d igit of production year shall be indicate as 20188, 2020 0 ,2021 1, ??? ) - 2digits production month (jan. to sep. ,shall be indicated as 01,02,03 , ????? ) - 2digits production date - 3digits serial number - 2digits tape and reel following number - 2digits luminous intensity rank . (if luminous intensity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified rank, " - - " shall be used to indicate.) - 2digits color (dominant wavelength) rank ( if c hromaticity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified rank , " - - " shall be used to indicate .) - 1digit option rank (stanley normally print " - " to indicate.)
vfhd1116p - 4c32b - tr correspondence to rohs ? elv instruction this product is in compliance with rohs ? elv. prohibition substance and it's criteria value of rohs ? elv are as follows. ? rohs instruction refer to following (1) (6). ? elv instruction . refer to following (1) (4). substance group name criteria value (1) lead and its compounds 1,000ppm max (2) cadmium and its compounds 100ppm max (3) mercury and its compounds 1,000ppm max (4) hexavalent chromium 1,000ppm max (5) pbb 1,000ppm max (6) pbde 1,000ppm max page : 19 2014.6.17
vfhd1116p - 4c32b - tr reliability testing result 2. failure criteria page : 20 2014.6.17 1. reliability testing result 1 maximum rated current at maximum rated operating temperature 2 reference test v f forward voltage testing max. value R standard max. value 1.2 item i f value of each product luminous intensity i v reverse current testing max. value R standard max. value 2.5 i r v r =5v condition luminous intensity testing min. value standard min. value 0.5 i f value of each product forward voltage symbol cosmetic appearance - no notable, decollation, deformation and cracking - failure criteria eiaj ed-4701 /100(101) ta=25 maximum rated current 1,000h 0 / 20 ta=85 maximum rated current 1 1,000h 0 / 20 test item standard test condition duration failure operating life 1,000h 0 / 20 low temperature operating life eiaj ed-4701 /100(101) ta=-40 maximum rated current 1,000h 0 / 20 high temperature operating life eiaj ed-4701 /100(101) 1,000h 0 / 20 wet high temperature operating life eiaj ed-4701 /100(102) ta=60 maximum rated current rh=90% 1,000h 0 / 20 high temperature storage life eiaj ed-4701 /200(201) ta = tstg max. maximum storage temperature 0 / 20 low temperature storage life eiaj ed-4701 /200(202) ta = tstg min. minimum storage temperature 1,000h 0 / 20 wet high temperature storage life eiaj ed-4701 /100(101) ta=60 rh=90% resistance to reflow soldering eiaj ed-4701 /300(301) moisture soak 30 70% 168h preheating 150 180 120sec max. soldering 260 5sec 2times 0 / 20 thermal shock eiaj ed-4701 /100(105) ta= tstg max. tstg min. (each 15min) 1,000 cycles electric static discharge(esd) 2 eiaj ed-4701 /300(304) c=100pf r2=1.5k 2,000v once each polarity 0 / 10 electric static discharge(esd) 2 eiaj ed-4701 /300(304) c=200pf r2=0?200v once each polarity 0 / 10 vibration, variable frequency eiaj ed-4701 /400(403) 98.1m/s 2 (10g) 100 2,000hz 20min sweep xyz direction 2h of each direction 0 / 10
vfhd1116p - 4c32b - tr special notice to customers using the products and technical information shown in this data sheet 1) the technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. it does not constitute the warranting of industrial property nor the granting of any license. 2) for the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. therefore it is recommended that the most updated specifications be used in your design. 3) when using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. we are not responsible for any damage which may occur if these specifications are exceeded. 4 ) the products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (oa equipment, telecommunications equipment, av machine, home appliance and measuring instrument). the application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except oa equipment, telecommunications equipment, av machine , home appliance and measuring instrument. 5) in order to export the products or technologies described in this data sheet which are under the foreign exchange and foreign trade control law, it is necessary to first obtain an export permit from the japanese government. 6) no part of this data sheet may be reprinted or reproduced without prior written permission from stanley electric co., ltd. 7) the most updated edition of this data sheet can be obtained from the address below: http:// www.stanley - components.com/en page : 21 2014.6.17

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